JPS54128958A - Capillary for ultrasonic sound bonding - Google Patents

Capillary for ultrasonic sound bonding

Info

Publication number
JPS54128958A
JPS54128958A JP3778878A JP3778878A JPS54128958A JP S54128958 A JPS54128958 A JP S54128958A JP 3778878 A JP3778878 A JP 3778878A JP 3778878 A JP3778878 A JP 3778878A JP S54128958 A JPS54128958 A JP S54128958A
Authority
JP
Japan
Prior art keywords
capillary
ultrasonic sound
sound bonding
bonding
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3778878A
Other languages
Japanese (ja)
Inventor
Hideki Miyanaga
Susumu Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP3778878A priority Critical patent/JPS54128958A/en
Publication of JPS54128958A publication Critical patent/JPS54128958A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
JP3778878A 1978-03-30 1978-03-30 Capillary for ultrasonic sound bonding Pending JPS54128958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3778878A JPS54128958A (en) 1978-03-30 1978-03-30 Capillary for ultrasonic sound bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3778878A JPS54128958A (en) 1978-03-30 1978-03-30 Capillary for ultrasonic sound bonding

Publications (1)

Publication Number Publication Date
JPS54128958A true JPS54128958A (en) 1979-10-05

Family

ID=12507220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3778878A Pending JPS54128958A (en) 1978-03-30 1978-03-30 Capillary for ultrasonic sound bonding

Country Status (1)

Country Link
JP (1) JPS54128958A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036225A (en) * 1973-08-06 1975-04-05
JPS528675A (en) * 1975-07-09 1977-01-22 Matsushita Electric Ind Co Ltd Dehydrating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036225A (en) * 1973-08-06 1975-04-05
JPS528675A (en) * 1975-07-09 1977-01-22 Matsushita Electric Ind Co Ltd Dehydrating device

Similar Documents

Publication Publication Date Title
GB2032223B (en) Ultrasonic transducer
ES525958A0 (en) ULTRASONIC TRANSDUCER
GB2019565B (en) Ultrasonic transducer array
FR2559985B1 (en) ULTRASONIC TRANSDUCER
GB2028054B (en) Acoustic transducer
AU544464B2 (en) Ultrasonic transducer
DE3272470D1 (en) Ultrasonic transducer
DE3380880D1 (en) Ultrasonic transducers
FR2499806B1 (en) ULTRASONIC TRANSDUCER
ZA793580B (en) Electro-acoustic transducer
DE3465808D1 (en) Ultrasonic transducer
FR2462837B1 (en) ULTRASONIC TRANSDUCER
DE3268681D1 (en) Ultrasonic transducer
JPS57168156A (en) Ultrasonic imspector
HUT49752A (en) Device for bonding by ultrasonic sound
GB2028227B (en) Bonding
DE3172788D1 (en) Ultrasonic transducer
AU7085381A (en) Ultrasonic transducer
GB2102657B (en) Ultrasonic transducers
JPS5325390A (en) Ultrasonic transducer
GB2092409B (en) Ultrasonic transducer
JPS54128958A (en) Capillary for ultrasonic sound bonding
GB2097630B (en) Ultrasonic transducers
JPS57110957A (en) Ultrasonic vibrator
JPS5799377A (en) Ultrasonic vibrator