JPS54128677A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS54128677A
JPS54128677A JP3731078A JP3731078A JPS54128677A JP S54128677 A JPS54128677 A JP S54128677A JP 3731078 A JP3731078 A JP 3731078A JP 3731078 A JP3731078 A JP 3731078A JP S54128677 A JPS54128677 A JP S54128677A
Authority
JP
Japan
Prior art keywords
independent
package
separating
cut
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3731078A
Other languages
Japanese (ja)
Inventor
Saburo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP3731078A priority Critical patent/JPS54128677A/en
Publication of JPS54128677A publication Critical patent/JPS54128677A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To make easy the handling, by separating the tie bar part of the specific leads of the lead frame of semiconductor groups into independent and separating it after a given inspection.
CONSTITUTION: In the group of the devie 8 in package 7 with resin which mounts semiconductor elements on the lead frame, the tie bars 4a and 4b are cut off and the lead chips are made independent from the frame, respectively making possible independent operation for the device 8. After that, measurement is made at a given position during the conveyor carrying, unrequired tie bars are cut off at the cutting process based on the result into respective separation, and only non-defective goods are stamped. Thus, stable measurement is made easy without damaging the package and causing the bending of leads and the reduction in index can remarkably be made.
COPYRIGHT: (C)1979,JPO&Japio
JP3731078A 1978-03-29 1978-03-29 Manufacture for semiconductor device Pending JPS54128677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3731078A JPS54128677A (en) 1978-03-29 1978-03-29 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3731078A JPS54128677A (en) 1978-03-29 1978-03-29 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54128677A true JPS54128677A (en) 1979-10-05

Family

ID=12494113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3731078A Pending JPS54128677A (en) 1978-03-29 1978-03-29 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54128677A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008134426A2 (en) * 2007-04-27 2008-11-06 Microchip Technology Incorporated Leadframe configuration to enable strip testing of sot-23 packages and the like

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008134426A2 (en) * 2007-04-27 2008-11-06 Microchip Technology Incorporated Leadframe configuration to enable strip testing of sot-23 packages and the like
WO2008134426A3 (en) * 2007-04-27 2008-12-24 Microchip Tech Inc Leadframe configuration to enable strip testing of sot-23 packages and the like

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