JPS54128677A - Manufacture for semiconductor device - Google Patents
Manufacture for semiconductor deviceInfo
- Publication number
- JPS54128677A JPS54128677A JP3731078A JP3731078A JPS54128677A JP S54128677 A JPS54128677 A JP S54128677A JP 3731078 A JP3731078 A JP 3731078A JP 3731078 A JP3731078 A JP 3731078A JP S54128677 A JPS54128677 A JP S54128677A
- Authority
- JP
- Japan
- Prior art keywords
- independent
- package
- separating
- cut
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To make easy the handling, by separating the tie bar part of the specific leads of the lead frame of semiconductor groups into independent and separating it after a given inspection.
CONSTITUTION: In the group of the devie 8 in package 7 with resin which mounts semiconductor elements on the lead frame, the tie bars 4a and 4b are cut off and the lead chips are made independent from the frame, respectively making possible independent operation for the device 8. After that, measurement is made at a given position during the conveyor carrying, unrequired tie bars are cut off at the cutting process based on the result into respective separation, and only non-defective goods are stamped. Thus, stable measurement is made easy without damaging the package and causing the bending of leads and the reduction in index can remarkably be made.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3731078A JPS54128677A (en) | 1978-03-29 | 1978-03-29 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3731078A JPS54128677A (en) | 1978-03-29 | 1978-03-29 | Manufacture for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54128677A true JPS54128677A (en) | 1979-10-05 |
Family
ID=12494113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3731078A Pending JPS54128677A (en) | 1978-03-29 | 1978-03-29 | Manufacture for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54128677A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008134426A2 (en) * | 2007-04-27 | 2008-11-06 | Microchip Technology Incorporated | Leadframe configuration to enable strip testing of sot-23 packages and the like |
-
1978
- 1978-03-29 JP JP3731078A patent/JPS54128677A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008134426A2 (en) * | 2007-04-27 | 2008-11-06 | Microchip Technology Incorporated | Leadframe configuration to enable strip testing of sot-23 packages and the like |
WO2008134426A3 (en) * | 2007-04-27 | 2008-12-24 | Microchip Tech Inc | Leadframe configuration to enable strip testing of sot-23 packages and the like |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1174563B (en) | PROCEDURE FOR DISCARDING CERTAIN PACKAGES, SUCH AS INDUSTRIAL CONTAINERS, BOTTLE BOXES ETC., FROM A PACKAGE PARK AND DEVICE ON A PACKAGE TO IDENTIFY A PACKAGE TO BE DISCARDED | |
ATE139194T1 (en) | DEVICE FOR ATTACHING A MULTI-PACK CARRYING ELEMENT | |
JPS54128677A (en) | Manufacture for semiconductor device | |
ATE21500T1 (en) | DEVICE FOR CHECK-WEIGHING PACKAGES. | |
JPS5434774A (en) | Article transfer device | |
JPS5563854A (en) | Method of manufacturing semiconductor device | |
MY108646A (en) | Method and device for manufacturing a single product from integrated circuits received on a lead frame. | |
ATE99246T1 (en) | DEVICE FOR CONTINUOUSLY SEPARATING PACKAGING CONTAINERS CONNECTED IN A CHAIN. | |
SE8207460L (en) | measuring device | |
JPS5524451A (en) | Lead frame for semiconductor | |
JPS5530810A (en) | Automatic bonding system for semiconductor device assembling | |
JPS54152966A (en) | Manufacture of semiconductor integrated-circuit device | |
SE8000561L (en) | DEVICE FOR DISPOSING THREADS OR BANDS FROM EXAMPLE PACKAGING | |
JPS51112273A (en) | Lead frame for resin mold type semiconductor device | |
JPS5427772A (en) | Production of semiconductor devices | |
JPS51138358A (en) | Electronic circuit testing apparatus | |
ES472212A1 (en) | Automatic machine for de-palletising containers - has feeding station, packets removal station and discharge station at which packets are separated | |
JPS6437049A (en) | Resin-sealed semiconductor device | |
JPS5241883A (en) | Bobin separation arrangment apparatus | |
JPS5210678A (en) | Ic package | |
JPS53108368A (en) | Manufacture for resin seal type semiconductor device and its lead frame for its manufacture | |
JPS5366157A (en) | Method for semiconductor processing | |
JPS5284977A (en) | Testing method for semicondcutor products | |
JPS649135A (en) | Method and apparatus for opening packed body | |
JPS5382261A (en) | Semiconductor wafer dicing method |