JPS54128669U - - Google Patents

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Publication number
JPS54128669U
JPS54128669U JP2491678U JP2491678U JPS54128669U JP S54128669 U JPS54128669 U JP S54128669U JP 2491678 U JP2491678 U JP 2491678U JP 2491678 U JP2491678 U JP 2491678U JP S54128669 U JPS54128669 U JP S54128669U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2491678U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2491678U priority Critical patent/JPS54128669U/ja
Publication of JPS54128669U publication Critical patent/JPS54128669U/ja
Pending legal-status Critical Current

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JP2491678U 1978-02-27 1978-02-27 Pending JPS54128669U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2491678U JPS54128669U (enrdf_load_stackoverflow) 1978-02-27 1978-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2491678U JPS54128669U (enrdf_load_stackoverflow) 1978-02-27 1978-02-27

Publications (1)

Publication Number Publication Date
JPS54128669U true JPS54128669U (enrdf_load_stackoverflow) 1979-09-07

Family

ID=28864295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2491678U Pending JPS54128669U (enrdf_load_stackoverflow) 1978-02-27 1978-02-27

Country Status (1)

Country Link
JP (1) JPS54128669U (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
JP2017012842A (ja) * 2016-10-17 2017-01-19 パナソニックＩｐマネジメント株式会社 オーラルケアセット

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013885U (enrdf_load_stackoverflow) * 1973-06-05 1975-02-13
JPS5238367U (enrdf_load_stackoverflow) * 1975-09-10 1977-03-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013885U (enrdf_load_stackoverflow) * 1973-06-05 1975-02-13
JPS5238367U (enrdf_load_stackoverflow) * 1975-09-10 1977-03-18

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7579694B2 (en) 2003-02-18 2009-08-25 Unitive International Limited Electronic devices including offset conductive bumps
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
JP2017012842A (ja) * 2016-10-17 2017-01-19 パナソニックＩｐマネジメント株式会社 オーラルケアセット

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