JPS54127580A - Laser scribing method - Google Patents
Laser scribing methodInfo
- Publication number
- JPS54127580A JPS54127580A JP3579578A JP3579578A JPS54127580A JP S54127580 A JPS54127580 A JP S54127580A JP 3579578 A JP3579578 A JP 3579578A JP 3579578 A JP3579578 A JP 3579578A JP S54127580 A JPS54127580 A JP S54127580A
- Authority
- JP
- Japan
- Prior art keywords
- laser scribing
- scribing method
- laser
- scribing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laser Beam Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3579578A JPS54127580A (en) | 1978-03-27 | 1978-03-27 | Laser scribing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3579578A JPS54127580A (en) | 1978-03-27 | 1978-03-27 | Laser scribing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54127580A true JPS54127580A (en) | 1979-10-03 |
Family
ID=12451848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3579578A Pending JPS54127580A (en) | 1978-03-27 | 1978-03-27 | Laser scribing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54127580A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61152093A (en) * | 1984-12-26 | 1986-07-10 | 株式会社日立製作所 | Boring of printed circuit board by energy beam |
JP2003203889A (en) * | 2002-01-08 | 2003-07-18 | Fujitsu Ltd | Method for manufacturing semiconductor device |
JP2006286763A (en) * | 2005-03-31 | 2006-10-19 | Disco Abrasive Syst Ltd | Laser machining method and laser machining apparatus for wafer |
JP2008031021A (en) * | 2006-07-31 | 2008-02-14 | Optrex Corp | Method of cutting substrate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49116955A (en) * | 1973-03-09 | 1974-11-08 | ||
JPS5040068A (en) * | 1973-08-14 | 1975-04-12 |
-
1978
- 1978-03-27 JP JP3579578A patent/JPS54127580A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49116955A (en) * | 1973-03-09 | 1974-11-08 | ||
JPS5040068A (en) * | 1973-08-14 | 1975-04-12 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61152093A (en) * | 1984-12-26 | 1986-07-10 | 株式会社日立製作所 | Boring of printed circuit board by energy beam |
JPH0479158B2 (en) * | 1984-12-26 | 1992-12-15 | Hitachi Ltd | |
JP2003203889A (en) * | 2002-01-08 | 2003-07-18 | Fujitsu Ltd | Method for manufacturing semiconductor device |
JP2006286763A (en) * | 2005-03-31 | 2006-10-19 | Disco Abrasive Syst Ltd | Laser machining method and laser machining apparatus for wafer |
JP4648056B2 (en) * | 2005-03-31 | 2011-03-09 | 株式会社ディスコ | Wafer laser processing method and laser processing apparatus |
JP2008031021A (en) * | 2006-07-31 | 2008-02-14 | Optrex Corp | Method of cutting substrate |
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