JPS54126958A - Method of molding wiring pattern for circuit board - Google Patents

Method of molding wiring pattern for circuit board

Info

Publication number
JPS54126958A
JPS54126958A JP3467678A JP3467678A JPS54126958A JP S54126958 A JPS54126958 A JP S54126958A JP 3467678 A JP3467678 A JP 3467678A JP 3467678 A JP3467678 A JP 3467678A JP S54126958 A JPS54126958 A JP S54126958A
Authority
JP
Japan
Prior art keywords
circuit board
wiring pattern
molding wiring
molding
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3467678A
Other languages
English (en)
Inventor
Yuujirou Haida
Tatatomi Nishikubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP3467678A priority Critical patent/JPS54126958A/ja
Publication of JPS54126958A publication Critical patent/JPS54126958A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Developing Agents For Electrophotography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP3467678A 1978-03-25 1978-03-25 Method of molding wiring pattern for circuit board Pending JPS54126958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3467678A JPS54126958A (en) 1978-03-25 1978-03-25 Method of molding wiring pattern for circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3467678A JPS54126958A (en) 1978-03-25 1978-03-25 Method of molding wiring pattern for circuit board

Publications (1)

Publication Number Publication Date
JPS54126958A true JPS54126958A (en) 1979-10-02

Family

ID=12421022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3467678A Pending JPS54126958A (en) 1978-03-25 1978-03-25 Method of molding wiring pattern for circuit board

Country Status (1)

Country Link
JP (1) JPS54126958A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981063U (ja) * 1982-11-22 1984-05-31 住友ゴム工業株式会社 プリント配線基板
US7670742B2 (en) 2005-03-15 2010-03-02 Ricoh Company, Ltd. Recording material, toner, liquid developer and image forming method using the same
US7682774B2 (en) 2006-04-13 2010-03-23 Lg Chem, Ltd. Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981063U (ja) * 1982-11-22 1984-05-31 住友ゴム工業株式会社 プリント配線基板
US7670742B2 (en) 2005-03-15 2010-03-02 Ricoh Company, Ltd. Recording material, toner, liquid developer and image forming method using the same
US7682774B2 (en) 2006-04-13 2010-03-23 Lg Chem, Ltd. Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods

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