JPS54122869A - Method of producing circuit board - Google Patents
Method of producing circuit boardInfo
- Publication number
- JPS54122869A JPS54122869A JP3071978A JP3071978A JPS54122869A JP S54122869 A JPS54122869 A JP S54122869A JP 3071978 A JP3071978 A JP 3071978A JP 3071978 A JP3071978 A JP 3071978A JP S54122869 A JPS54122869 A JP S54122869A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- producing circuit
- producing
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3071978A JPS54122869A (en) | 1978-03-17 | 1978-03-17 | Method of producing circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3071978A JPS54122869A (en) | 1978-03-17 | 1978-03-17 | Method of producing circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54122869A true JPS54122869A (en) | 1979-09-22 |
Family
ID=12311444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3071978A Pending JPS54122869A (en) | 1978-03-17 | 1978-03-17 | Method of producing circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54122869A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015522218A (en) * | 2012-07-13 | 2015-08-03 | ノードソン コーポレーションNordson Corporation | Vacuum assisted underfill method for electronic devices |
-
1978
- 1978-03-17 JP JP3071978A patent/JPS54122869A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015522218A (en) * | 2012-07-13 | 2015-08-03 | ノードソン コーポレーションNordson Corporation | Vacuum assisted underfill method for electronic devices |
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