JPS54120371U - - Google Patents
Info
- Publication number
- JPS54120371U JPS54120371U JP1978016513U JP1651378U JPS54120371U JP S54120371 U JPS54120371 U JP S54120371U JP 1978016513 U JP1978016513 U JP 1978016513U JP 1651378 U JP1651378 U JP 1651378U JP S54120371 U JPS54120371 U JP S54120371U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978016513U JPS54120371U (enExample) | 1978-02-10 | 1978-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978016513U JPS54120371U (enExample) | 1978-02-10 | 1978-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54120371U true JPS54120371U (enExample) | 1979-08-23 |
Family
ID=28840166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978016513U Pending JPS54120371U (enExample) | 1978-02-10 | 1978-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54120371U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394118A (zh) * | 2020-03-13 | 2021-09-14 | 长鑫存储技术有限公司 | 封装结构及其形成方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029415U (enExample) * | 1973-07-10 | 1975-04-03 |
-
1978
- 1978-02-10 JP JP1978016513U patent/JPS54120371U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029415U (enExample) * | 1973-07-10 | 1975-04-03 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113394118A (zh) * | 2020-03-13 | 2021-09-14 | 长鑫存储技术有限公司 | 封装结构及其形成方法 |
| CN113394118B (zh) * | 2020-03-13 | 2022-03-18 | 长鑫存储技术有限公司 | 封装结构及其形成方法 |