JPS54118572A - Connection method of microscopic element - Google Patents

Connection method of microscopic element

Info

Publication number
JPS54118572A
JPS54118572A JP2576578A JP2576578A JPS54118572A JP S54118572 A JPS54118572 A JP S54118572A JP 2576578 A JP2576578 A JP 2576578A JP 2576578 A JP2576578 A JP 2576578A JP S54118572 A JPS54118572 A JP S54118572A
Authority
JP
Japan
Prior art keywords
connection method
microscopic element
microscopic
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2576578A
Other languages
Japanese (ja)
Inventor
Hiroshi Oshitari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2576578A priority Critical patent/JPS54118572A/en
Publication of JPS54118572A publication Critical patent/JPS54118572A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2576578A 1978-03-06 1978-03-06 Connection method of microscopic element Pending JPS54118572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2576578A JPS54118572A (en) 1978-03-06 1978-03-06 Connection method of microscopic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2576578A JPS54118572A (en) 1978-03-06 1978-03-06 Connection method of microscopic element

Publications (1)

Publication Number Publication Date
JPS54118572A true JPS54118572A (en) 1979-09-14

Family

ID=12174924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2576578A Pending JPS54118572A (en) 1978-03-06 1978-03-06 Connection method of microscopic element

Country Status (1)

Country Link
JP (1) JPS54118572A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206379A (en) * 1991-10-04 1993-08-13 Internatl Business Mach Corp <Ibm> Multichip module and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206379A (en) * 1991-10-04 1993-08-13 Internatl Business Mach Corp <Ibm> Multichip module and its manufacture

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