JPS54115863U - - Google Patents
Info
- Publication number
- JPS54115863U JPS54115863U JP1978010202U JP1020278U JPS54115863U JP S54115863 U JPS54115863 U JP S54115863U JP 1978010202 U JP1978010202 U JP 1978010202U JP 1020278 U JP1020278 U JP 1020278U JP S54115863 U JPS54115863 U JP S54115863U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978010202U JPS54115863U (enExample) | 1978-02-01 | 1978-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978010202U JPS54115863U (enExample) | 1978-02-01 | 1978-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54115863U true JPS54115863U (enExample) | 1979-08-14 |
Family
ID=28822356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978010202U Pending JPS54115863U (enExample) | 1978-02-01 | 1978-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54115863U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5023975A (enExample) * | 1973-07-03 | 1975-03-14 | ||
| JPS5023775A (enExample) * | 1973-06-30 | 1975-03-14 |
-
1978
- 1978-02-01 JP JP1978010202U patent/JPS54115863U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5023775A (enExample) * | 1973-06-30 | 1975-03-14 | ||
| JPS5023975A (enExample) * | 1973-07-03 | 1975-03-14 |