JPS54108832A - Hot-melt adhesive composition for metal - Google Patents
Hot-melt adhesive composition for metalInfo
- Publication number
- JPS54108832A JPS54108832A JP1601678A JP1601678A JPS54108832A JP S54108832 A JPS54108832 A JP S54108832A JP 1601678 A JP1601678 A JP 1601678A JP 1601678 A JP1601678 A JP 1601678A JP S54108832 A JPS54108832 A JP S54108832A
- Authority
- JP
- Japan
- Prior art keywords
- salt
- adhesive
- acid
- hot
- melt adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polyamides (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: An adhesive to be bonded quickly for side seams of metallic cans, consisting of a crystalline copolymer obtained by copolymerizing a specific ratio of an equimolar salt of hexamethylenediamine and dodecandicarboxlic acid with a condensation product of a ≤13C lactam and a 6W13C alkane dicarboxylic acid excluding the equimolar salt.
CONSTITUTION: A hot-melt adhesive for metal consisting of a crystalline copolyamide obtained by copolymerizing A) an equimolar salt of hexamethylenediamine and dodecanedicarboxylic acid (6.12 salt), with B) a condensation product of 6W 13C lactam, ω-amimocarboxylic acid, or a 6W13C alkylenediamine with a 6W13C alkane-dicarboxylic acid excluding 6.12 salt in a weight ratio of A to B of 90W65 : 10W35, preferably 85W70 :15W30. The polymerization degree of the adhesive preferably has relative viscosity of 1.70W2.40 measured by using 0.5 wt.% solution of the adhesive in m-cresol at 25°C.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1601678A JPS6057472B2 (en) | 1978-02-15 | 1978-02-15 | Hot melt adhesive composition for metals |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1601678A JPS6057472B2 (en) | 1978-02-15 | 1978-02-15 | Hot melt adhesive composition for metals |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15552985A Division JPS61106624A (en) | 1985-07-15 | 1985-07-15 | Copolymer resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54108832A true JPS54108832A (en) | 1979-08-25 |
JPS6057472B2 JPS6057472B2 (en) | 1985-12-14 |
Family
ID=11904767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1601678A Expired JPS6057472B2 (en) | 1978-02-15 | 1978-02-15 | Hot melt adhesive composition for metals |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6057472B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61106624A (en) * | 1985-07-15 | 1986-05-24 | Daicel Chem Ind Ltd | Copolymer resin |
-
1978
- 1978-02-15 JP JP1601678A patent/JPS6057472B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61106624A (en) * | 1985-07-15 | 1986-05-24 | Daicel Chem Ind Ltd | Copolymer resin |
JPS623172B2 (en) * | 1985-07-15 | 1987-01-23 | Daicel Chem |
Also Published As
Publication number | Publication date |
---|---|
JPS6057472B2 (en) | 1985-12-14 |
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