JPS5410665A - Sealing method of sealing tube for semiconductor heat treatment - Google Patents

Sealing method of sealing tube for semiconductor heat treatment

Info

Publication number
JPS5410665A
JPS5410665A JP7556577A JP7556577A JPS5410665A JP S5410665 A JPS5410665 A JP S5410665A JP 7556577 A JP7556577 A JP 7556577A JP 7556577 A JP7556577 A JP 7556577A JP S5410665 A JPS5410665 A JP S5410665A
Authority
JP
Japan
Prior art keywords
sealing
heat treatment
tube
semiconductor heat
sealing tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7556577A
Other languages
Japanese (ja)
Inventor
Hiroyuki Taniguchi
Naohiro Monma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7556577A priority Critical patent/JPS5410665A/en
Publication of JPS5410665A publication Critical patent/JPS5410665A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To prevent the deformation of a glass sealing tube at the heat treatment by putting the inside of an ampoule tube under exhausted and reduced pressure condition, closing its sample inserting port and making the temperature resing portion at the time, of gas sealing small in relation to the entire aprt of the ampoule tube.
COPYRIGHT: (C)1979,JPO&Japio
JP7556577A 1977-06-27 1977-06-27 Sealing method of sealing tube for semiconductor heat treatment Pending JPS5410665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7556577A JPS5410665A (en) 1977-06-27 1977-06-27 Sealing method of sealing tube for semiconductor heat treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7556577A JPS5410665A (en) 1977-06-27 1977-06-27 Sealing method of sealing tube for semiconductor heat treatment

Publications (1)

Publication Number Publication Date
JPS5410665A true JPS5410665A (en) 1979-01-26

Family

ID=13579822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7556577A Pending JPS5410665A (en) 1977-06-27 1977-06-27 Sealing method of sealing tube for semiconductor heat treatment

Country Status (1)

Country Link
JP (1) JPS5410665A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128424A (en) * 1991-07-18 1992-07-07 Japan Synthetic Rubber Co., Ltd. Epoxy resin, mercato curing agent and polysulfide adduct

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128424A (en) * 1991-07-18 1992-07-07 Japan Synthetic Rubber Co., Ltd. Epoxy resin, mercato curing agent and polysulfide adduct

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