JPS54103747U - - Google Patents
Info
- Publication number
- JPS54103747U JPS54103747U JP17844377U JP17844377U JPS54103747U JP S54103747 U JPS54103747 U JP S54103747U JP 17844377 U JP17844377 U JP 17844377U JP 17844377 U JP17844377 U JP 17844377U JP S54103747 U JPS54103747 U JP S54103747U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Packaging Frangible Articles (AREA)
- Wire Bonding (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977178443U JPS5841188Y2 (en) | 1977-12-29 | 1977-12-29 | Spool case for bonding wire for semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977178443U JPS5841188Y2 (en) | 1977-12-29 | 1977-12-29 | Spool case for bonding wire for semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54103747U true JPS54103747U (en) | 1979-07-21 |
| JPS5841188Y2 JPS5841188Y2 (en) | 1983-09-17 |
Family
ID=29188907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977178443U Expired JPS5841188Y2 (en) | 1977-12-29 | 1977-12-29 | Spool case for bonding wire for semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5841188Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100398832B1 (en) | 2001-10-31 | 2003-09-19 | 헤라우스오리엔탈하이텍 주식회사 | Spool case for bonding wire and method for handling spool using the case |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4422252Y1 (en) * | 1967-04-11 | 1969-09-19 |
-
1977
- 1977-12-29 JP JP1977178443U patent/JPS5841188Y2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4422252Y1 (en) * | 1967-04-11 | 1969-09-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5841188Y2 (en) | 1983-09-17 |