JPS54100255A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS54100255A
JPS54100255A JP621578A JP621578A JPS54100255A JP S54100255 A JPS54100255 A JP S54100255A JP 621578 A JP621578 A JP 621578A JP 621578 A JP621578 A JP 621578A JP S54100255 A JPS54100255 A JP S54100255A
Authority
JP
Japan
Prior art keywords
lever
bonding
projection
forced
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP621578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6112376B2 (enrdf_load_stackoverflow
Inventor
Osamu Tachibana
Masahiro Horii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP621578A priority Critical patent/JPS54100255A/ja
Publication of JPS54100255A publication Critical patent/JPS54100255A/ja
Publication of JPS6112376B2 publication Critical patent/JPS6112376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP621578A 1978-01-25 1978-01-25 Wire bonding device Granted JPS54100255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP621578A JPS54100255A (en) 1978-01-25 1978-01-25 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP621578A JPS54100255A (en) 1978-01-25 1978-01-25 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS54100255A true JPS54100255A (en) 1979-08-07
JPS6112376B2 JPS6112376B2 (enrdf_load_stackoverflow) 1986-04-08

Family

ID=11632293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP621578A Granted JPS54100255A (en) 1978-01-25 1978-01-25 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS54100255A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199573U (enrdf_load_stackoverflow) * 1987-06-15 1988-12-22

Also Published As

Publication number Publication date
JPS6112376B2 (enrdf_load_stackoverflow) 1986-04-08

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