JPS54100255A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPS54100255A JPS54100255A JP621578A JP621578A JPS54100255A JP S54100255 A JPS54100255 A JP S54100255A JP 621578 A JP621578 A JP 621578A JP 621578 A JP621578 A JP 621578A JP S54100255 A JPS54100255 A JP S54100255A
- Authority
- JP
- Japan
- Prior art keywords
- lever
- bonding
- projection
- forced
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP621578A JPS54100255A (en) | 1978-01-25 | 1978-01-25 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP621578A JPS54100255A (en) | 1978-01-25 | 1978-01-25 | Wire bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54100255A true JPS54100255A (en) | 1979-08-07 |
| JPS6112376B2 JPS6112376B2 (cg-RX-API-DMAC7.html) | 1986-04-08 |
Family
ID=11632293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP621578A Granted JPS54100255A (en) | 1978-01-25 | 1978-01-25 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54100255A (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63199573U (cg-RX-API-DMAC7.html) * | 1987-06-15 | 1988-12-22 |
-
1978
- 1978-01-25 JP JP621578A patent/JPS54100255A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6112376B2 (cg-RX-API-DMAC7.html) | 1986-04-08 |
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