JPS539837B2 - - Google Patents
Info
- Publication number
- JPS539837B2 JPS539837B2 JP952573A JP952573A JPS539837B2 JP S539837 B2 JPS539837 B2 JP S539837B2 JP 952573 A JP952573 A JP 952573A JP 952573 A JP952573 A JP 952573A JP S539837 B2 JPS539837 B2 JP S539837B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP952573A JPS539837B2 (zh) | 1973-01-24 | 1973-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP952573A JPS539837B2 (zh) | 1973-01-24 | 1973-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4998960A JPS4998960A (zh) | 1974-09-19 |
| JPS539837B2 true JPS539837B2 (zh) | 1978-04-08 |
Family
ID=11722671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP952573A Expired JPS539837B2 (zh) | 1973-01-24 | 1973-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS539837B2 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8940619B2 (en) * | 2012-07-13 | 2015-01-27 | Applied Materials, Inc. | Method of diced wafer transportation |
-
1973
- 1973-01-24 JP JP952573A patent/JPS539837B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4998960A (zh) | 1974-09-19 |