JPS5397957A - Method and apparatus for manufacturing solder fine wire - Google Patents

Method and apparatus for manufacturing solder fine wire

Info

Publication number
JPS5397957A
JPS5397957A JP1217577A JP1217577A JPS5397957A JP S5397957 A JPS5397957 A JP S5397957A JP 1217577 A JP1217577 A JP 1217577A JP 1217577 A JP1217577 A JP 1217577A JP S5397957 A JPS5397957 A JP S5397957A
Authority
JP
Japan
Prior art keywords
fine wire
solder fine
manufacturing solder
manufacturing
enable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1217577A
Other languages
Japanese (ja)
Inventor
Takao Terabayashi
Kenichi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1217577A priority Critical patent/JPS5397957A/en
Publication of JPS5397957A publication Critical patent/JPS5397957A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metal Extraction Processes (AREA)

Abstract

PURPOSE:To enable to easily obtain the solder wire, having very small diameter, by maintaining front and rear part of drawing dies at a fixed temperature less than room temperature.
JP1217577A 1977-02-08 1977-02-08 Method and apparatus for manufacturing solder fine wire Pending JPS5397957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1217577A JPS5397957A (en) 1977-02-08 1977-02-08 Method and apparatus for manufacturing solder fine wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1217577A JPS5397957A (en) 1977-02-08 1977-02-08 Method and apparatus for manufacturing solder fine wire

Publications (1)

Publication Number Publication Date
JPS5397957A true JPS5397957A (en) 1978-08-26

Family

ID=11798082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1217577A Pending JPS5397957A (en) 1977-02-08 1977-02-08 Method and apparatus for manufacturing solder fine wire

Country Status (1)

Country Link
JP (1) JPS5397957A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064729A (en) * 2015-09-28 2017-04-06 新日鐵住金株式会社 Method and device for cooling steel drawn wire, and wire drawing apparatus for steel wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064729A (en) * 2015-09-28 2017-04-06 新日鐵住金株式会社 Method and device for cooling steel drawn wire, and wire drawing apparatus for steel wire

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