JPS5397395A - Semiconductor luminous display unit - Google Patents

Semiconductor luminous display unit

Info

Publication number
JPS5397395A
JPS5397395A JP1222277A JP1222277A JPS5397395A JP S5397395 A JPS5397395 A JP S5397395A JP 1222277 A JP1222277 A JP 1222277A JP 1222277 A JP1222277 A JP 1222277A JP S5397395 A JPS5397395 A JP S5397395A
Authority
JP
Japan
Prior art keywords
display unit
luminous display
semiconductor luminous
chip
selection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1222277A
Other languages
Japanese (ja)
Inventor
Tetsuo Sadamasa
Makoto Naito
Tadao Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1222277A priority Critical patent/JPS5397395A/en
Priority to DE19772725265 priority patent/DE2725265A1/en
Priority to US05/803,984 priority patent/US4145707A/en
Publication of JPS5397395A publication Critical patent/JPS5397395A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors

Abstract

PURPOSE: To enhance the wire bonding working efficiency as well as to better the outward appearance, by displaying the figures through dynamic driving for the chip selection and the light emission within the chip by securing combinations with the segment selection.
COPYRIGHT: (C)1978,JPO&Japio
JP1222277A 1976-06-04 1977-02-07 Semiconductor luminous display unit Pending JPS5397395A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1222277A JPS5397395A (en) 1977-02-07 1977-02-07 Semiconductor luminous display unit
DE19772725265 DE2725265A1 (en) 1976-06-04 1977-06-03 SEMI-CONDUCTOR LIGHT DISPLAY DEVICE
US05/803,984 US4145707A (en) 1976-06-04 1977-06-06 Semiconductor luminescent display apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1222277A JPS5397395A (en) 1977-02-07 1977-02-07 Semiconductor luminous display unit

Publications (1)

Publication Number Publication Date
JPS5397395A true JPS5397395A (en) 1978-08-25

Family

ID=11799343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1222277A Pending JPS5397395A (en) 1976-06-04 1977-02-07 Semiconductor luminous display unit

Country Status (1)

Country Link
JP (1) JPS5397395A (en)

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