JPS5392621A - Color solid image pickup unit - Google Patents

Color solid image pickup unit

Info

Publication number
JPS5392621A
JPS5392621A JP708277A JP708277A JPS5392621A JP S5392621 A JPS5392621 A JP S5392621A JP 708277 A JP708277 A JP 708277A JP 708277 A JP708277 A JP 708277A JP S5392621 A JPS5392621 A JP S5392621A
Authority
JP
Japan
Prior art keywords
image pickup
pickup unit
solid image
color solid
color filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP708277A
Other languages
Japanese (ja)
Other versions
JPS62638B2 (en
Inventor
Takamichi Wada
Yasuaki Terui
Masaru Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP708277A priority Critical patent/JPS5392621A/en
Publication of JPS5392621A publication Critical patent/JPS5392621A/en
Publication of JPS62638B2 publication Critical patent/JPS62638B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Light Receiving Elements (AREA)
  • Color Television Image Signal Generators (AREA)

Abstract

PURPOSE: To simplify the alignment of a photo detecting part and a color filter and the fixing of the color filter and prevent light interference and scattering by providing a fixed fiber plate on one main face of a light transmission body through the color filter.
COPYRIGHT: (C)1978,JPO&Japio
JP708277A 1977-01-24 1977-01-24 Color solid image pickup unit Granted JPS5392621A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP708277A JPS5392621A (en) 1977-01-24 1977-01-24 Color solid image pickup unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP708277A JPS5392621A (en) 1977-01-24 1977-01-24 Color solid image pickup unit

Publications (2)

Publication Number Publication Date
JPS5392621A true JPS5392621A (en) 1978-08-14
JPS62638B2 JPS62638B2 (en) 1987-01-08

Family

ID=11656156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP708277A Granted JPS5392621A (en) 1977-01-24 1977-01-24 Color solid image pickup unit

Country Status (1)

Country Link
JP (1) JPS5392621A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710274A (en) * 1980-06-23 1982-01-19 Toshiba Corp Solid color imaging device
US5300767A (en) * 1992-04-15 1994-04-05 Hewlett-Packard Company Color image sensing assembly with multiple linear sensors and aligned filters
US7914926B2 (en) 2005-03-17 2011-03-29 Hitachi Maxell, Ltd. Flat-shaped battery

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157189U (en) * 1988-04-20 1989-10-30

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157018A (en) * 1974-06-08 1975-12-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157018A (en) * 1974-06-08 1975-12-18

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710274A (en) * 1980-06-23 1982-01-19 Toshiba Corp Solid color imaging device
US5300767A (en) * 1992-04-15 1994-04-05 Hewlett-Packard Company Color image sensing assembly with multiple linear sensors and aligned filters
US7914926B2 (en) 2005-03-17 2011-03-29 Hitachi Maxell, Ltd. Flat-shaped battery

Also Published As

Publication number Publication date
JPS62638B2 (en) 1987-01-08

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