JPS539251Y2 - - Google Patents
Info
- Publication number
- JPS539251Y2 JPS539251Y2 JP1974154778U JP15477874U JPS539251Y2 JP S539251 Y2 JPS539251 Y2 JP S539251Y2 JP 1974154778 U JP1974154778 U JP 1974154778U JP 15477874 U JP15477874 U JP 15477874U JP S539251 Y2 JPS539251 Y2 JP S539251Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15157—Top view
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974154778U JPS539251Y2 (en:Method) | 1974-12-19 | 1974-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974154778U JPS539251Y2 (en:Method) | 1974-12-19 | 1974-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5180059U JPS5180059U (en:Method) | 1976-06-25 |
| JPS539251Y2 true JPS539251Y2 (en:Method) | 1978-03-10 |
Family
ID=28446110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974154778U Expired JPS539251Y2 (en:Method) | 1974-12-19 | 1974-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS539251Y2 (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS554985A (en) * | 1978-06-27 | 1980-01-14 | Nec Kyushu Ltd | Lead frame for semiconductor device |
| JP5140413B2 (ja) * | 2007-12-28 | 2013-02-06 | 株式会社日立製作所 | 実装基板、及びこの実装基板を備えるｌｅｄ光源装置 |
-
1974
- 1974-12-19 JP JP1974154778U patent/JPS539251Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5180059U (en:Method) | 1976-06-25 |