JPS539251Y2 - - Google Patents
Info
- Publication number
- JPS539251Y2 JPS539251Y2 JP1974154778U JP15477874U JPS539251Y2 JP S539251 Y2 JPS539251 Y2 JP S539251Y2 JP 1974154778 U JP1974154778 U JP 1974154778U JP 15477874 U JP15477874 U JP 15477874U JP S539251 Y2 JPS539251 Y2 JP S539251Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974154778U JPS539251Y2 (cg-RX-API-DMAC7.html) | 1974-12-19 | 1974-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974154778U JPS539251Y2 (cg-RX-API-DMAC7.html) | 1974-12-19 | 1974-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5180059U JPS5180059U (cg-RX-API-DMAC7.html) | 1976-06-25 |
| JPS539251Y2 true JPS539251Y2 (cg-RX-API-DMAC7.html) | 1978-03-10 |
Family
ID=28446110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974154778U Expired JPS539251Y2 (cg-RX-API-DMAC7.html) | 1974-12-19 | 1974-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS539251Y2 (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS554985A (en) * | 1978-06-27 | 1980-01-14 | Nec Kyushu Ltd | Lead frame for semiconductor device |
| JP5140413B2 (ja) * | 2007-12-28 | 2013-02-06 | 株式会社日立製作所 | 実装基板、及びこの実装基板を備えるｌｅｄ光源装置 |
-
1974
- 1974-12-19 JP JP1974154778U patent/JPS539251Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5180059U (cg-RX-API-DMAC7.html) | 1976-06-25 |