JPS5389274U - - Google Patents
Info
- Publication number
- JPS5389274U JPS5389274U JP1976170865U JP17086576U JPS5389274U JP S5389274 U JPS5389274 U JP S5389274U JP 1976170865 U JP1976170865 U JP 1976170865U JP 17086576 U JP17086576 U JP 17086576U JP S5389274 U JPS5389274 U JP S5389274U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976170865U JPS5389274U (enExample) | 1976-12-22 | 1976-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976170865U JPS5389274U (enExample) | 1976-12-22 | 1976-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5389274U true JPS5389274U (enExample) | 1978-07-21 |
Family
ID=28778403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976170865U Pending JPS5389274U (enExample) | 1976-12-22 | 1976-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5389274U (enExample) |
-
1976
- 1976-12-22 JP JP1976170865U patent/JPS5389274U/ja active Pending