JPS5383072U - - Google Patents
Info
- Publication number
- JPS5383072U JPS5383072U JP16743076U JP16743076U JPS5383072U JP S5383072 U JPS5383072 U JP S5383072U JP 16743076 U JP16743076 U JP 16743076U JP 16743076 U JP16743076 U JP 16743076U JP S5383072 U JPS5383072 U JP S5383072U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16743076U JPS5383072U (enrdf_load_html_response) | 1976-12-13 | 1976-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16743076U JPS5383072U (enrdf_load_html_response) | 1976-12-13 | 1976-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5383072U true JPS5383072U (enrdf_load_html_response) | 1978-07-10 |
Family
ID=28775112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16743076U Pending JPS5383072U (enrdf_load_html_response) | 1976-12-13 | 1976-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5383072U (enrdf_load_html_response) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4994271A (enrdf_load_html_response) * | 1973-01-10 | 1974-09-06 |
-
1976
- 1976-12-13 JP JP16743076U patent/JPS5383072U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4994271A (enrdf_load_html_response) * | 1973-01-10 | 1974-09-06 |