JPS5381568U - - Google Patents
Info
- Publication number
- JPS5381568U JPS5381568U JP15330277U JP15330277U JPS5381568U JP S5381568 U JPS5381568 U JP S5381568U JP 15330277 U JP15330277 U JP 15330277U JP 15330277 U JP15330277 U JP 15330277U JP S5381568 U JPS5381568 U JP S5381568U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742405930 DE2405930C3 (de) | 1974-02-07 | Halbleiterbauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5381568U true JPS5381568U (enrdf_load_stackoverflow) | 1978-07-06 |
Family
ID=5906872
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1523875A Pending JPS50115773A (enrdf_load_stackoverflow) | 1974-02-07 | 1975-02-05 | |
| JP15330277U Pending JPS5381568U (enrdf_load_stackoverflow) | 1974-02-07 | 1977-11-15 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1523875A Pending JPS50115773A (enrdf_load_stackoverflow) | 1974-02-07 | 1975-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JPS50115773A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54181873U (enrdf_load_stackoverflow) * | 1978-06-13 | 1979-12-22 | ||
| JPS5855649Y2 (ja) * | 1978-12-04 | 1983-12-20 | 三菱電機株式会社 | 半導体装置 |
| US4313128A (en) * | 1979-05-08 | 1982-01-26 | Westinghouse Electric Corp. | Compression bonded electronic device comprising a plurality of discrete semiconductor devices |
| JPS5829622B2 (ja) * | 1981-10-30 | 1983-06-23 | 三菱電機株式会社 | 制御電極端子付圧接形半導体装置の組立て方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4112338Y1 (enrdf_load_stackoverflow) * | 1965-01-13 | 1966-06-10 |
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1975
- 1975-02-05 JP JP1523875A patent/JPS50115773A/ja active Pending
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1977
- 1977-11-15 JP JP15330277U patent/JPS5381568U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4112338Y1 (enrdf_load_stackoverflow) * | 1965-01-13 | 1966-06-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2405930A1 (de) | 1975-08-21 |
| JPS50115773A (enrdf_load_stackoverflow) | 1975-09-10 |
| DE2405930B2 (de) | 1976-10-07 |