JPS537890B2 - - Google Patents
Info
- Publication number
- JPS537890B2 JPS537890B2 JP11220772A JP11220772A JPS537890B2 JP S537890 B2 JPS537890 B2 JP S537890B2 JP 11220772 A JP11220772 A JP 11220772A JP 11220772 A JP11220772 A JP 11220772A JP S537890 B2 JPS537890 B2 JP S537890B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Extrusion Of Metal (AREA)
- Forging (AREA)
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220772A JPS537890B2 (Sortimente) | 1972-11-10 | 1972-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220772A JPS537890B2 (Sortimente) | 1972-11-10 | 1972-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4974618A JPS4974618A (Sortimente) | 1974-07-18 |
| JPS537890B2 true JPS537890B2 (Sortimente) | 1978-03-23 |
Family
ID=14580921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11220772A Expired JPS537890B2 (Sortimente) | 1972-11-10 | 1972-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS537890B2 (Sortimente) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12057427B2 (en) | 2021-02-22 | 2024-08-06 | Shinkawa Ltd. | Wire bonding apparatus |
-
1972
- 1972-11-10 JP JP11220772A patent/JPS537890B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12057427B2 (en) | 2021-02-22 | 2024-08-06 | Shinkawa Ltd. | Wire bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4974618A (Sortimente) | 1974-07-18 |