JPS5378172A - Pinacoid for work - Google Patents

Pinacoid for work

Info

Publication number
JPS5378172A
JPS5378172A JP15471576A JP15471576A JPS5378172A JP S5378172 A JPS5378172 A JP S5378172A JP 15471576 A JP15471576 A JP 15471576A JP 15471576 A JP15471576 A JP 15471576A JP S5378172 A JPS5378172 A JP S5378172A
Authority
JP
Japan
Prior art keywords
pinacoid
work
shaping
floating
spherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15471576A
Other languages
Japanese (ja)
Inventor
Masamichi Yoshimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15471576A priority Critical patent/JPS5378172A/en
Publication of JPS5378172A publication Critical patent/JPS5378172A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PURPOSE: To achieve the uniform pressure-welding work by shaping the side circumference of a working pinacoid into spherical and by floating it freely on the fluid in the container.
COPYRIGHT: (C)1978,JPO&Japio
JP15471576A 1976-12-22 1976-12-22 Pinacoid for work Pending JPS5378172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15471576A JPS5378172A (en) 1976-12-22 1976-12-22 Pinacoid for work

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15471576A JPS5378172A (en) 1976-12-22 1976-12-22 Pinacoid for work

Publications (1)

Publication Number Publication Date
JPS5378172A true JPS5378172A (en) 1978-07-11

Family

ID=15590369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15471576A Pending JPS5378172A (en) 1976-12-22 1976-12-22 Pinacoid for work

Country Status (1)

Country Link
JP (1) JPS5378172A (en)

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