JPS53761U - - Google Patents
Info
- Publication number
- JPS53761U JPS53761U JP1976082380U JP8238076U JPS53761U JP S53761 U JPS53761 U JP S53761U JP 1976082380 U JP1976082380 U JP 1976082380U JP 8238076 U JP8238076 U JP 8238076U JP S53761 U JPS53761 U JP S53761U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976082380U JPS53761U (ko) | 1976-06-23 | 1976-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976082380U JPS53761U (ko) | 1976-06-23 | 1976-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53761U true JPS53761U (ko) | 1978-01-06 |
Family
ID=28562849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976082380U Pending JPS53761U (ko) | 1976-06-23 | 1976-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53761U (ko) |
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1976
- 1976-06-23 JP JP1976082380U patent/JPS53761U/ja active Pending