JPS5373888U - - Google Patents

Info

Publication number
JPS5373888U
JPS5373888U JP1976156270U JP15627076U JPS5373888U JP S5373888 U JPS5373888 U JP S5373888U JP 1976156270 U JP1976156270 U JP 1976156270U JP 15627076 U JP15627076 U JP 15627076U JP S5373888 U JPS5373888 U JP S5373888U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976156270U
Other languages
Japanese (ja)
Other versions
JPS5655725Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976156270U priority Critical patent/JPS5655725Y2/ja
Publication of JPS5373888U publication Critical patent/JPS5373888U/ja
Application granted granted Critical
Publication of JPS5655725Y2 publication Critical patent/JPS5655725Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP1976156270U 1976-11-19 1976-11-19 Expired JPS5655725Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976156270U JPS5655725Y2 (https=) 1976-11-19 1976-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976156270U JPS5655725Y2 (https=) 1976-11-19 1976-11-19

Publications (2)

Publication Number Publication Date
JPS5373888U true JPS5373888U (https=) 1978-06-20
JPS5655725Y2 JPS5655725Y2 (https=) 1981-12-25

Family

ID=28764360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976156270U Expired JPS5655725Y2 (https=) 1976-11-19 1976-11-19

Country Status (1)

Country Link
JP (1) JPS5655725Y2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006080312A (ja) * 2004-09-09 2006-03-23 Toyoda Gosei Co Ltd 発光装置およびその製造方法
US7842526B2 (en) 2004-09-09 2010-11-30 Toyoda Gosei Co., Ltd. Light emitting device and method of producing same
JP2017201731A (ja) * 2017-08-22 2017-11-09 日亜化学工業株式会社 発光装置
JP2020053617A (ja) * 2018-09-28 2020-04-02 日亜化学工業株式会社 発光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014378U (https=) * 1973-06-06 1975-02-14
JPS50152586U (https=) * 1974-06-04 1975-12-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014378U (https=) * 1973-06-06 1975-02-14
JPS50152586U (https=) * 1974-06-04 1975-12-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006080312A (ja) * 2004-09-09 2006-03-23 Toyoda Gosei Co Ltd 発光装置およびその製造方法
US7842526B2 (en) 2004-09-09 2010-11-30 Toyoda Gosei Co., Ltd. Light emitting device and method of producing same
JP2017201731A (ja) * 2017-08-22 2017-11-09 日亜化学工業株式会社 発光装置
JP2020053617A (ja) * 2018-09-28 2020-04-02 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
JPS5655725Y2 (https=) 1981-12-25

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