JPS5373888U - - Google Patents

Info

Publication number
JPS5373888U
JPS5373888U JP15627076U JP15627076U JPS5373888U JP S5373888 U JPS5373888 U JP S5373888U JP 15627076 U JP15627076 U JP 15627076U JP 15627076 U JP15627076 U JP 15627076U JP S5373888 U JPS5373888 U JP S5373888U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15627076U
Other languages
Japanese (ja)
Other versions
JPS5655725Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976156270U priority Critical patent/JPS5655725Y2/ja
Publication of JPS5373888U publication Critical patent/JPS5373888U/ja
Application granted granted Critical
Publication of JPS5655725Y2 publication Critical patent/JPS5655725Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1976156270U 1976-11-19 1976-11-19 Expired JPS5655725Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976156270U JPS5655725Y2 (enrdf_load_stackoverflow) 1976-11-19 1976-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976156270U JPS5655725Y2 (enrdf_load_stackoverflow) 1976-11-19 1976-11-19

Publications (2)

Publication Number Publication Date
JPS5373888U true JPS5373888U (enrdf_load_stackoverflow) 1978-06-20
JPS5655725Y2 JPS5655725Y2 (enrdf_load_stackoverflow) 1981-12-25

Family

ID=28764360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976156270U Expired JPS5655725Y2 (enrdf_load_stackoverflow) 1976-11-19 1976-11-19

Country Status (1)

Country Link
JP (1) JPS5655725Y2 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006080312A (ja) * 2004-09-09 2006-03-23 Toyoda Gosei Co Ltd 発光装置およびその製造方法
US7842526B2 (en) 2004-09-09 2010-11-30 Toyoda Gosei Co., Ltd. Light emitting device and method of producing same
JP2017201731A (ja) * 2017-08-22 2017-11-09 日亜化学工業株式会社 発光装置
JP2020053617A (ja) * 2018-09-28 2020-04-02 日亜化学工業株式会社 発光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014378U (enrdf_load_stackoverflow) * 1973-06-06 1975-02-14
JPS50152586U (enrdf_load_stackoverflow) * 1974-06-04 1975-12-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014378U (enrdf_load_stackoverflow) * 1973-06-06 1975-02-14
JPS50152586U (enrdf_load_stackoverflow) * 1974-06-04 1975-12-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006080312A (ja) * 2004-09-09 2006-03-23 Toyoda Gosei Co Ltd 発光装置およびその製造方法
US7842526B2 (en) 2004-09-09 2010-11-30 Toyoda Gosei Co., Ltd. Light emitting device and method of producing same
JP2017201731A (ja) * 2017-08-22 2017-11-09 日亜化学工業株式会社 発光装置
JP2020053617A (ja) * 2018-09-28 2020-04-02 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
JPS5655725Y2 (enrdf_load_stackoverflow) 1981-12-25

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