JPS5373888U - - Google Patents
Info
- Publication number
- JPS5373888U JPS5373888U JP15627076U JP15627076U JPS5373888U JP S5373888 U JPS5373888 U JP S5373888U JP 15627076 U JP15627076 U JP 15627076U JP 15627076 U JP15627076 U JP 15627076U JP S5373888 U JPS5373888 U JP S5373888U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976156270U JPS5655725Y2 (de) | 1976-11-19 | 1976-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976156270U JPS5655725Y2 (de) | 1976-11-19 | 1976-11-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5373888U true JPS5373888U (de) | 1978-06-20 |
| JPS5655725Y2 JPS5655725Y2 (de) | 1981-12-25 |
Family
ID=28764360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976156270U Expired JPS5655725Y2 (de) | 1976-11-19 | 1976-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5655725Y2 (de) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006080312A (ja) * | 2004-09-09 | 2006-03-23 | Toyoda Gosei Co Ltd | 発光装置およびその製造方法 |
| US7842526B2 (en) | 2004-09-09 | 2010-11-30 | Toyoda Gosei Co., Ltd. | Light emitting device and method of producing same |
| JP2017201731A (ja) * | 2017-08-22 | 2017-11-09 | 日亜化学工業株式会社 | 発光装置 |
| JP2020053617A (ja) * | 2018-09-28 | 2020-04-02 | 日亜化学工業株式会社 | 発光装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014378U (de) * | 1973-06-06 | 1975-02-14 | ||
| JPS50152586U (de) * | 1974-06-04 | 1975-12-18 |
-
1976
- 1976-11-19 JP JP1976156270U patent/JPS5655725Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014378U (de) * | 1973-06-06 | 1975-02-14 | ||
| JPS50152586U (de) * | 1974-06-04 | 1975-12-18 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006080312A (ja) * | 2004-09-09 | 2006-03-23 | Toyoda Gosei Co Ltd | 発光装置およびその製造方法 |
| US7842526B2 (en) | 2004-09-09 | 2010-11-30 | Toyoda Gosei Co., Ltd. | Light emitting device and method of producing same |
| JP4590994B2 (ja) * | 2004-09-09 | 2010-12-01 | 豊田合成株式会社 | 発光装置およびその製造方法 |
| JP2017201731A (ja) * | 2017-08-22 | 2017-11-09 | 日亜化学工業株式会社 | 発光装置 |
| JP2020053617A (ja) * | 2018-09-28 | 2020-04-02 | 日亜化学工業株式会社 | 発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5655725Y2 (de) | 1981-12-25 |