JPS5373370A - Method of dipping printed board in solder - Google Patents

Method of dipping printed board in solder

Info

Publication number
JPS5373370A
JPS5373370A JP14963576A JP14963576A JPS5373370A JP S5373370 A JPS5373370 A JP S5373370A JP 14963576 A JP14963576 A JP 14963576A JP 14963576 A JP14963576 A JP 14963576A JP S5373370 A JPS5373370 A JP S5373370A
Authority
JP
Japan
Prior art keywords
dipping
solder
printed board
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14963576A
Other languages
Japanese (ja)
Inventor
Zenichi Matsuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14963576A priority Critical patent/JPS5373370A/en
Publication of JPS5373370A publication Critical patent/JPS5373370A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14963576A 1976-12-13 1976-12-13 Method of dipping printed board in solder Pending JPS5373370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14963576A JPS5373370A (en) 1976-12-13 1976-12-13 Method of dipping printed board in solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14963576A JPS5373370A (en) 1976-12-13 1976-12-13 Method of dipping printed board in solder

Publications (1)

Publication Number Publication Date
JPS5373370A true JPS5373370A (en) 1978-06-29

Family

ID=15479525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14963576A Pending JPS5373370A (en) 1976-12-13 1976-12-13 Method of dipping printed board in solder

Country Status (1)

Country Link
JP (1) JPS5373370A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59174270A (en) * 1983-03-23 1984-10-02 Hitachi Ltd Gushing type soldering device for printed wiring board
JPS6052667U (en) * 1983-09-20 1985-04-13 日本電子機器株式会社 Automatic soldering device for printed circuit boards
JPS60141954U (en) * 1984-02-24 1985-09-20 千住金属工業株式会社 Jet flow monitoring device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59174270A (en) * 1983-03-23 1984-10-02 Hitachi Ltd Gushing type soldering device for printed wiring board
JPS6052667U (en) * 1983-09-20 1985-04-13 日本電子機器株式会社 Automatic soldering device for printed circuit boards
JPS60141954U (en) * 1984-02-24 1985-09-20 千住金属工業株式会社 Jet flow monitoring device

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