JPS5371372U - - Google Patents
Info
- Publication number
- JPS5371372U JPS5371372U JP15331076U JP15331076U JPS5371372U JP S5371372 U JPS5371372 U JP S5371372U JP 15331076 U JP15331076 U JP 15331076U JP 15331076 U JP15331076 U JP 15331076U JP S5371372 U JPS5371372 U JP S5371372U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15331076U JPS5371372U (is) | 1976-11-17 | 1976-11-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15331076U JPS5371372U (is) | 1976-11-17 | 1976-11-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5371372U true JPS5371372U (is) | 1978-06-15 |
Family
ID=28761492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15331076U Pending JPS5371372U (is) | 1976-11-17 | 1976-11-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5371372U (is) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013236004A (ja) * | 2012-05-10 | 2013-11-21 | Toshiba Corp | 圧接型半導体装置、及び圧接型半導体装置の圧接方法 |
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1976
- 1976-11-17 JP JP15331076U patent/JPS5371372U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013236004A (ja) * | 2012-05-10 | 2013-11-21 | Toshiba Corp | 圧接型半導体装置、及び圧接型半導体装置の圧接方法 |