JPS5368493A - Surface polishing method - Google Patents

Surface polishing method

Info

Publication number
JPS5368493A
JPS5368493A JP14292276A JP14292276A JPS5368493A JP S5368493 A JPS5368493 A JP S5368493A JP 14292276 A JP14292276 A JP 14292276A JP 14292276 A JP14292276 A JP 14292276A JP S5368493 A JPS5368493 A JP S5368493A
Authority
JP
Japan
Prior art keywords
surface polishing
polishing method
polishing
polishing disk
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14292276A
Other languages
Japanese (ja)
Inventor
Toshiro Karaki
Shojiro Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP14292276A priority Critical patent/JPS5368493A/en
Publication of JPS5368493A publication Critical patent/JPS5368493A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To provide a simple method of surface polishing, in which a heating body is held between metal plates and disposed downwardly of a polishing disk, whereby temperature on the surface of said polishing disk can be raised uniformly.
JP14292276A 1976-11-30 1976-11-30 Surface polishing method Pending JPS5368493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14292276A JPS5368493A (en) 1976-11-30 1976-11-30 Surface polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14292276A JPS5368493A (en) 1976-11-30 1976-11-30 Surface polishing method

Publications (1)

Publication Number Publication Date
JPS5368493A true JPS5368493A (en) 1978-06-17

Family

ID=15326740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14292276A Pending JPS5368493A (en) 1976-11-30 1976-11-30 Surface polishing method

Country Status (1)

Country Link
JP (1) JPS5368493A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879258A (en) * 1988-08-31 1989-11-07 Texas Instruments Incorporated Integrated circuit planarization by mechanical polishing
JPH02262955A (en) * 1988-12-15 1990-10-25 Nippon Steel Corp Method of cutting si ingot by wire saw
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US6022807A (en) * 1996-04-24 2000-02-08 Micro Processing Technology, Inc. Method for fabricating an integrated circuit
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6471566B1 (en) 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
JP2013059831A (en) * 2011-09-14 2013-04-04 Toho Engineering Kk Polishing pad auxiliary plate and polishing apparatus

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879258A (en) * 1988-08-31 1989-11-07 Texas Instruments Incorporated Integrated circuit planarization by mechanical polishing
JPH02262955A (en) * 1988-12-15 1990-10-25 Nippon Steel Corp Method of cutting si ingot by wire saw
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US6022807A (en) * 1996-04-24 2000-02-08 Micro Processing Technology, Inc. Method for fabricating an integrated circuit
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6471566B1 (en) 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6976903B1 (en) 2000-09-22 2005-12-20 Lam Research Corporation Apparatus for controlling retaining ring and wafer head tilt for chemical mechanical polishing
JP2013059831A (en) * 2011-09-14 2013-04-04 Toho Engineering Kk Polishing pad auxiliary plate and polishing apparatus

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