JPS5368073A - Method of heating lead frame - Google Patents

Method of heating lead frame

Info

Publication number
JPS5368073A
JPS5368073A JP14381376A JP14381376A JPS5368073A JP S5368073 A JPS5368073 A JP S5368073A JP 14381376 A JP14381376 A JP 14381376A JP 14381376 A JP14381376 A JP 14381376A JP S5368073 A JPS5368073 A JP S5368073A
Authority
JP
Japan
Prior art keywords
lead frame
heating lead
heating
frame
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14381376A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5712533B2 (https=
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP14381376A priority Critical patent/JPS5368073A/ja
Publication of JPS5368073A publication Critical patent/JPS5368073A/ja
Publication of JPS5712533B2 publication Critical patent/JPS5712533B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP14381376A 1976-11-29 1976-11-29 Method of heating lead frame Granted JPS5368073A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14381376A JPS5368073A (en) 1976-11-29 1976-11-29 Method of heating lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14381376A JPS5368073A (en) 1976-11-29 1976-11-29 Method of heating lead frame

Publications (2)

Publication Number Publication Date
JPS5368073A true JPS5368073A (en) 1978-06-17
JPS5712533B2 JPS5712533B2 (https=) 1982-03-11

Family

ID=15347555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14381376A Granted JPS5368073A (en) 1976-11-29 1976-11-29 Method of heating lead frame

Country Status (1)

Country Link
JP (1) JPS5368073A (https=)

Also Published As

Publication number Publication date
JPS5712533B2 (https=) 1982-03-11

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