JPS5366067U - - Google Patents

Info

Publication number
JPS5366067U
JPS5366067U JP14654776U JP14654776U JPS5366067U JP S5366067 U JPS5366067 U JP S5366067U JP 14654776 U JP14654776 U JP 14654776U JP 14654776 U JP14654776 U JP 14654776U JP S5366067 U JPS5366067 U JP S5366067U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14654776U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14654776U priority Critical patent/JPS5366067U/ja
Publication of JPS5366067U publication Critical patent/JPS5366067U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
JP14654776U 1976-10-29 1976-10-29 Pending JPS5366067U (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14654776U JPS5366067U (sv) 1976-10-29 1976-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14654776U JPS5366067U (sv) 1976-10-29 1976-10-29

Publications (1)

Publication Number Publication Date
JPS5366067U true JPS5366067U (sv) 1978-06-03

Family

ID=28755031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14654776U Pending JPS5366067U (sv) 1976-10-29 1976-10-29

Country Status (1)

Country Link
JP (1) JPS5366067U (sv)

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