JPS5366065U - - Google Patents

Info

Publication number
JPS5366065U
JPS5366065U JP14643076U JP14643076U JPS5366065U JP S5366065 U JPS5366065 U JP S5366065U JP 14643076 U JP14643076 U JP 14643076U JP 14643076 U JP14643076 U JP 14643076U JP S5366065 U JPS5366065 U JP S5366065U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14643076U
Other languages
Japanese (ja)
Other versions
JPS5729310Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976146430U priority Critical patent/JPS5729310Y2/ja
Publication of JPS5366065U publication Critical patent/JPS5366065U/ja
Application granted granted Critical
Publication of JPS5729310Y2 publication Critical patent/JPS5729310Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP1976146430U 1976-10-30 1976-10-30 Expired JPS5729310Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976146430U JPS5729310Y2 (enrdf_load_stackoverflow) 1976-10-30 1976-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976146430U JPS5729310Y2 (enrdf_load_stackoverflow) 1976-10-30 1976-10-30

Publications (2)

Publication Number Publication Date
JPS5366065U true JPS5366065U (enrdf_load_stackoverflow) 1978-06-03
JPS5729310Y2 JPS5729310Y2 (enrdf_load_stackoverflow) 1982-06-26

Family

ID=28754921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976146430U Expired JPS5729310Y2 (enrdf_load_stackoverflow) 1976-10-30 1976-10-30

Country Status (1)

Country Link
JP (1) JPS5729310Y2 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5091263A (enrdf_load_stackoverflow) * 1973-12-12 1975-07-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5091263A (enrdf_load_stackoverflow) * 1973-12-12 1975-07-21

Also Published As

Publication number Publication date
JPS5729310Y2 (enrdf_load_stackoverflow) 1982-06-26

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