JPS536573A - Cooling package using liquid material - Google Patents

Cooling package using liquid material

Info

Publication number
JPS536573A
JPS536573A JP11926676A JP11926676A JPS536573A JP S536573 A JPS536573 A JP S536573A JP 11926676 A JP11926676 A JP 11926676A JP 11926676 A JP11926676 A JP 11926676A JP S536573 A JPS536573 A JP S536573A
Authority
JP
Japan
Prior art keywords
liquid material
cooling package
package
cooling
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11926676A
Other languages
Japanese (ja)
Inventor
Shigeya Ano Jieimusu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDY Industries LLC
Original Assignee
Teledyne Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teledyne Industries Inc filed Critical Teledyne Industries Inc
Publication of JPS536573A publication Critical patent/JPS536573A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP11926676A 1976-07-05 1976-10-04 Cooling package using liquid material Pending JPS536573A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2790876 1976-07-05

Publications (1)

Publication Number Publication Date
JPS536573A true JPS536573A (en) 1978-01-21

Family

ID=10267243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11926676A Pending JPS536573A (en) 1976-07-05 1976-10-04 Cooling package using liquid material

Country Status (2)

Country Link
JP (1) JPS536573A (en)
BE (1) BE844721A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5540225A (en) * 1978-09-14 1980-03-21 Hitachi Ltd Controller for heat engine
JPS6345899A (en) * 1986-08-13 1988-02-26 日本発条株式会社 Board which can absorb heat

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005025381A1 (en) * 2005-05-31 2006-12-07 Behr Industry Gmbh & Co. Kg Device for cooling electronic components

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4322388Y1 (en) * 1965-11-15 1968-09-19
US3411041A (en) * 1967-07-17 1968-11-12 Hughes Aircraft Co Heat exchanger package for high-density, high-powered electronic modules
JPS5021381U (en) * 1973-06-15 1975-03-11

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4322388Y1 (en) * 1965-11-15 1968-09-19
US3411041A (en) * 1967-07-17 1968-11-12 Hughes Aircraft Co Heat exchanger package for high-density, high-powered electronic modules
JPS5021381U (en) * 1973-06-15 1975-03-11

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5540225A (en) * 1978-09-14 1980-03-21 Hitachi Ltd Controller for heat engine
JPS6118010B2 (en) * 1978-09-14 1986-05-10 Hitachi Ltd
JPS6345899A (en) * 1986-08-13 1988-02-26 日本発条株式会社 Board which can absorb heat

Also Published As

Publication number Publication date
BE844721A (en) 1977-01-31

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