JPS5361698A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5361698A JPS5361698A JP13763076A JP13763076A JPS5361698A JP S5361698 A JPS5361698 A JP S5361698A JP 13763076 A JP13763076 A JP 13763076A JP 13763076 A JP13763076 A JP 13763076A JP S5361698 A JPS5361698 A JP S5361698A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- curing agent
- tertiary amine
- agent containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: An epoxy resin composition giving reduced bubbles and improved discoloration to the cured products, which is composed of an epoxy resin, a curing agent containing an acid anhydride derived from maleic anhydride and a tertiary amine.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13763076A JPS5361698A (en) | 1976-11-16 | 1976-11-16 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13763076A JPS5361698A (en) | 1976-11-16 | 1976-11-16 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5361698A true JPS5361698A (en) | 1978-06-02 |
JPS5420240B2 JPS5420240B2 (en) | 1979-07-20 |
Family
ID=15203135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13763076A Granted JPS5361698A (en) | 1976-11-16 | 1976-11-16 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5361698A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5867051A (en) * | 1981-10-16 | 1983-04-21 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor element |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4869898A (en) * | 1971-12-24 | 1973-09-21 | ||
JPS5010399A (en) * | 1973-04-18 | 1975-02-03 |
-
1976
- 1976-11-16 JP JP13763076A patent/JPS5361698A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4869898A (en) * | 1971-12-24 | 1973-09-21 | ||
JPS5010399A (en) * | 1973-04-18 | 1975-02-03 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5867051A (en) * | 1981-10-16 | 1983-04-21 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing semiconductor element |
Also Published As
Publication number | Publication date |
---|---|
JPS5420240B2 (en) | 1979-07-20 |
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