JPS5353264A - Device for supplying sample - Google Patents

Device for supplying sample

Info

Publication number
JPS5353264A
JPS5353264A JP12779076A JP12779076A JPS5353264A JP S5353264 A JPS5353264 A JP S5353264A JP 12779076 A JP12779076 A JP 12779076A JP 12779076 A JP12779076 A JP 12779076A JP S5353264 A JPS5353264 A JP S5353264A
Authority
JP
Japan
Prior art keywords
supplying sample
supplying
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12779076A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5733853B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Yasunobu Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP12779076A priority Critical patent/JPS5353264A/ja
Publication of JPS5353264A publication Critical patent/JPS5353264A/ja
Publication of JPS5733853B2 publication Critical patent/JPS5733853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Warehouses Or Storage Devices (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Wire Bonding (AREA)
JP12779076A 1976-10-26 1976-10-26 Device for supplying sample Granted JPS5353264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12779076A JPS5353264A (en) 1976-10-26 1976-10-26 Device for supplying sample

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12779076A JPS5353264A (en) 1976-10-26 1976-10-26 Device for supplying sample

Publications (2)

Publication Number Publication Date
JPS5353264A true JPS5353264A (en) 1978-05-15
JPS5733853B2 JPS5733853B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-07-20

Family

ID=14968733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12779076A Granted JPS5353264A (en) 1976-10-26 1976-10-26 Device for supplying sample

Country Status (1)

Country Link
JP (1) JPS5353264A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186338U (ja) * 1983-05-30 1984-12-11 深沢　忠夫 足場用作業台

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913317U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-05-10 1974-02-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913317U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-05-10 1974-02-04

Also Published As

Publication number Publication date
JPS5733853B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1982-07-20

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