JPS5352773U - - Google Patents
Info
- Publication number
- JPS5352773U JPS5352773U JP13532976U JP13532976U JPS5352773U JP S5352773 U JPS5352773 U JP S5352773U JP 13532976 U JP13532976 U JP 13532976U JP 13532976 U JP13532976 U JP 13532976U JP S5352773 U JPS5352773 U JP S5352773U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13532976U JPS5352773U (enrdf_load_stackoverflow) | 1976-10-07 | 1976-10-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13532976U JPS5352773U (enrdf_load_stackoverflow) | 1976-10-07 | 1976-10-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5352773U true JPS5352773U (enrdf_load_stackoverflow) | 1978-05-06 |
Family
ID=28744220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13532976U Pending JPS5352773U (enrdf_load_stackoverflow) | 1976-10-07 | 1976-10-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5352773U (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6072434U (ja) * | 1983-10-26 | 1985-05-22 | カシオ計算機株式会社 | 複写装置 |
JPS62153088A (ja) * | 1985-12-26 | 1987-07-08 | 三井建設株式会社 | クレ−ンの通過警報装置 |
-
1976
- 1976-10-07 JP JP13532976U patent/JPS5352773U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6072434U (ja) * | 1983-10-26 | 1985-05-22 | カシオ計算機株式会社 | 複写装置 |
JPS62153088A (ja) * | 1985-12-26 | 1987-07-08 | 三井建設株式会社 | クレ−ンの通過警報装置 |