JPS5352765U - - Google Patents

Info

Publication number
JPS5352765U
JPS5352765U JP1976135658U JP13565876U JPS5352765U JP S5352765 U JPS5352765 U JP S5352765U JP 1976135658 U JP1976135658 U JP 1976135658U JP 13565876 U JP13565876 U JP 13565876U JP S5352765 U JPS5352765 U JP S5352765U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1976135658U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976135658U priority Critical patent/JPS5352765U/ja
Publication of JPS5352765U publication Critical patent/JPS5352765U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1976135658U 1976-10-07 1976-10-07 Pending JPS5352765U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976135658U JPS5352765U (2) 1976-10-07 1976-10-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976135658U JPS5352765U (2) 1976-10-07 1976-10-07

Publications (1)

Publication Number Publication Date
JPS5352765U true JPS5352765U (2) 1978-05-06

Family

ID=28744535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976135658U Pending JPS5352765U (2) 1976-10-07 1976-10-07

Country Status (1)

Country Link
JP (1) JPS5352765U (2)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146071A (2) * 1974-10-18 1976-04-20 Nippon Electric Co

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146071A (2) * 1974-10-18 1976-04-20 Nippon Electric Co

Similar Documents

Publication Publication Date Title
JPS615451B2 (2)
CS175507B1 (2)
JPS5352765U (2)
CS192123B1 (2)
CS178396B1 (2)
CS177783B1 (2)
CH605170A5 (2)
DD125727A1 (2)
CH603769A5 (2)
CH604260B5 (2)
CH604413A5 (2)
CH604708A5 (2)
DD126318A1 (2)
CH606592A5 (2)
CH606668A5 (2)
CH607163A5 (2)
CH607523A5 (2)
DD126358A1 (2)
CH613902A5 (2)
CH614170A5 (2)
CH614295A5 (2)
CH600205A5 (2)
CH599432A5 (2)
CH597162A5 (2)
CH596895A5 (2)