JPS5352764U - - Google Patents
Info
- Publication number
- JPS5352764U JPS5352764U JP1976133648U JP13364876U JPS5352764U JP S5352764 U JPS5352764 U JP S5352764U JP 1976133648 U JP1976133648 U JP 1976133648U JP 13364876 U JP13364876 U JP 13364876U JP S5352764 U JPS5352764 U JP S5352764U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1976133648U JPS5352764U (fr) | 1976-10-06 | 1976-10-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1976133648U JPS5352764U (fr) | 1976-10-06 | 1976-10-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5352764U true JPS5352764U (fr) | 1978-05-06 |
Family
ID=28742612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1976133648U Pending JPS5352764U (fr) | 1976-10-06 | 1976-10-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5352764U (fr) |
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1976
- 1976-10-06 JP JP1976133648U patent/JPS5352764U/ja active Pending