JPS5348602Y2 - - Google Patents
Info
- Publication number
- JPS5348602Y2 JPS5348602Y2 JP1975009713U JP971375U JPS5348602Y2 JP S5348602 Y2 JPS5348602 Y2 JP S5348602Y2 JP 1975009713 U JP1975009713 U JP 1975009713U JP 971375 U JP971375 U JP 971375U JP S5348602 Y2 JPS5348602 Y2 JP S5348602Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975009713U JPS5348602Y2 (cg-RX-API-DMAC7.html) | 1975-01-20 | 1975-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975009713U JPS5348602Y2 (cg-RX-API-DMAC7.html) | 1975-01-20 | 1975-01-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5192060U JPS5192060U (cg-RX-API-DMAC7.html) | 1976-07-23 |
| JPS5348602Y2 true JPS5348602Y2 (cg-RX-API-DMAC7.html) | 1978-11-21 |
Family
ID=28079858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975009713U Expired JPS5348602Y2 (cg-RX-API-DMAC7.html) | 1975-01-20 | 1975-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5348602Y2 (cg-RX-API-DMAC7.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4712859U (cg-RX-API-DMAC7.html) * | 1971-03-12 | 1972-10-16 |
-
1975
- 1975-01-20 JP JP1975009713U patent/JPS5348602Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5192060U (cg-RX-API-DMAC7.html) | 1976-07-23 |