JPS5344699B2 - - Google Patents
Info
- Publication number
- JPS5344699B2 JPS5344699B2 JP2260672A JP2260672A JPS5344699B2 JP S5344699 B2 JPS5344699 B2 JP S5344699B2 JP 2260672 A JP2260672 A JP 2260672A JP 2260672 A JP2260672 A JP 2260672A JP S5344699 B2 JPS5344699 B2 JP S5344699B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Combined Means For Separation Of Solids (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2260672A JPS5344699B2 (en) | 1972-03-04 | 1972-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2260672A JPS5344699B2 (en) | 1972-03-04 | 1972-03-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4890053A JPS4890053A (en) | 1973-11-24 |
| JPS5344699B2 true JPS5344699B2 (en) | 1978-11-30 |
Family
ID=12087488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2260672A Expired JPS5344699B2 (en) | 1972-03-04 | 1972-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5344699B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016168331A (en) * | 2015-03-10 | 2016-09-23 | 泰貴 服部 | Thin-skin removal device and thin-skin removal method |
| KR20210104879A (en) * | 2018-12-27 | 2021-08-25 | 가부시키가이샤 사무코 | Evaluation method of semiconductor wafer and manufacturing method of semiconductor wafer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51110758A (en) * | 1975-03-25 | 1976-09-30 | Kawasaki Heavy Ind Ltd | GOMIBUNBETSUSOCHI |
-
1972
- 1972-03-04 JP JP2260672A patent/JPS5344699B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016168331A (en) * | 2015-03-10 | 2016-09-23 | 泰貴 服部 | Thin-skin removal device and thin-skin removal method |
| JP2017164528A (en) * | 2015-03-10 | 2017-09-21 | 泰貴 服部 | Thin-skin removal device and thin-skin removal method |
| KR20210104879A (en) * | 2018-12-27 | 2021-08-25 | 가부시키가이샤 사무코 | Evaluation method of semiconductor wafer and manufacturing method of semiconductor wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4890053A (en) | 1973-11-24 |