JPS5344413U - - Google Patents

Info

Publication number
JPS5344413U
JPS5344413U JP1976125396U JP12539676U JPS5344413U JP S5344413 U JPS5344413 U JP S5344413U JP 1976125396 U JP1976125396 U JP 1976125396U JP 12539676 U JP12539676 U JP 12539676U JP S5344413 U JPS5344413 U JP S5344413U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976125396U
Other languages
Japanese (ja)
Other versions
JPS57703Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976125396U priority Critical patent/JPS57703Y2/ja
Publication of JPS5344413U publication Critical patent/JPS5344413U/ja
Application granted granted Critical
Publication of JPS57703Y2 publication Critical patent/JPS57703Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07251Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)
  • Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
  • Structure Of Telephone Exchanges (AREA)
JP1976125396U 1976-09-20 1976-09-20 Expired JPS57703Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976125396U JPS57703Y2 (https=) 1976-09-20 1976-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976125396U JPS57703Y2 (https=) 1976-09-20 1976-09-20

Publications (2)

Publication Number Publication Date
JPS5344413U true JPS5344413U (https=) 1978-04-15
JPS57703Y2 JPS57703Y2 (https=) 1982-01-07

Family

ID=28734808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976125396U Expired JPS57703Y2 (https=) 1976-09-20 1976-09-20

Country Status (1)

Country Link
JP (1) JPS57703Y2 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS459249Y1 (https=) * 1966-10-29 1970-04-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS459249Y1 (https=) * 1966-10-29 1970-04-30

Also Published As

Publication number Publication date
JPS57703Y2 (https=) 1982-01-07

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