JPS5343297A - Device for grinding both surfaces - Google Patents
Device for grinding both surfacesInfo
- Publication number
- JPS5343297A JPS5343297A JP11817676A JP11817676A JPS5343297A JP S5343297 A JPS5343297 A JP S5343297A JP 11817676 A JP11817676 A JP 11817676A JP 11817676 A JP11817676 A JP 11817676A JP S5343297 A JPS5343297 A JP S5343297A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- carrier
- impart
- slide
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE: To impart an eccentric circular motion to a carrier relative to upper and lower grinding dishes so as to slide and process specimens to be ground which are inserted in the carrier to a uniform thickness.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11817676A JPS5343297A (en) | 1976-09-30 | 1976-09-30 | Device for grinding both surfaces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11817676A JPS5343297A (en) | 1976-09-30 | 1976-09-30 | Device for grinding both surfaces |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5343297A true JPS5343297A (en) | 1978-04-19 |
Family
ID=14730000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11817676A Pending JPS5343297A (en) | 1976-09-30 | 1976-09-30 | Device for grinding both surfaces |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5343297A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0549253U (en) * | 1991-11-29 | 1993-06-29 | 三菱マテリアル株式会社 | Semiconductor wafer polishing machine |
-
1976
- 1976-09-30 JP JP11817676A patent/JPS5343297A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0549253U (en) * | 1991-11-29 | 1993-06-29 | 三菱マテリアル株式会社 | Semiconductor wafer polishing machine |
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