JPS5340764U - - Google Patents
Info
- Publication number
- JPS5340764U JPS5340764U JP1976107233U JP10723376U JPS5340764U JP S5340764 U JPS5340764 U JP S5340764U JP 1976107233 U JP1976107233 U JP 1976107233U JP 10723376 U JP10723376 U JP 10723376U JP S5340764 U JPS5340764 U JP S5340764U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976107233U JPS5340764U (de) | 1976-08-10 | 1976-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976107233U JPS5340764U (de) | 1976-08-10 | 1976-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5340764U true JPS5340764U (de) | 1978-04-08 |
Family
ID=28717280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976107233U Pending JPS5340764U (de) | 1976-08-10 | 1976-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5340764U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021052068A (ja) * | 2019-09-24 | 2021-04-01 | 株式会社東芝 | パワーモジュール |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4944520U (de) * | 1972-07-20 | 1974-04-19 | ||
| JPS5143567B2 (de) * | 1972-08-09 | 1976-11-22 |
-
1976
- 1976-08-10 JP JP1976107233U patent/JPS5340764U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4944520U (de) * | 1972-07-20 | 1974-04-19 | ||
| JPS5143567B2 (de) * | 1972-08-09 | 1976-11-22 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021052068A (ja) * | 2019-09-24 | 2021-04-01 | 株式会社東芝 | パワーモジュール |