JPS5339114B2 - - Google Patents

Info

Publication number
JPS5339114B2
JPS5339114B2 JP10053272A JP10053272A JPS5339114B2 JP S5339114 B2 JPS5339114 B2 JP S5339114B2 JP 10053272 A JP10053272 A JP 10053272A JP 10053272 A JP10053272 A JP 10053272A JP S5339114 B2 JPS5339114 B2 JP S5339114B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10053272A
Other languages
Japanese (ja)
Other versions
JPS4959584A (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10053272A priority Critical patent/JPS5339114B2/ja
Publication of JPS4959584A publication Critical patent/JPS4959584A/ja
Publication of JPS5339114B2 publication Critical patent/JPS5339114B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP10053272A 1972-10-05 1972-10-05 Expired JPS5339114B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10053272A JPS5339114B2 (enrdf_load_html_response) 1972-10-05 1972-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10053272A JPS5339114B2 (enrdf_load_html_response) 1972-10-05 1972-10-05

Publications (2)

Publication Number Publication Date
JPS4959584A JPS4959584A (enrdf_load_html_response) 1974-06-10
JPS5339114B2 true JPS5339114B2 (enrdf_load_html_response) 1978-10-19

Family

ID=14276556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10053272A Expired JPS5339114B2 (enrdf_load_html_response) 1972-10-05 1972-10-05

Country Status (1)

Country Link
JP (1) JPS5339114B2 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0339769U (enrdf_load_html_response) * 1989-08-28 1991-04-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0339769U (enrdf_load_html_response) * 1989-08-28 1991-04-17

Also Published As

Publication number Publication date
JPS4959584A (enrdf_load_html_response) 1974-06-10

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