JPS5338975U - - Google Patents
Info
- Publication number
- JPS5338975U JPS5338975U JP1976119974U JP11997476U JPS5338975U JP S5338975 U JPS5338975 U JP S5338975U JP 1976119974 U JP1976119974 U JP 1976119974U JP 11997476 U JP11997476 U JP 11997476U JP S5338975 U JPS5338975 U JP S5338975U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1976119974U JPS5338975U (en) | 1976-09-08 | 1976-09-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1976119974U JPS5338975U (en) | 1976-09-08 | 1976-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5338975U true JPS5338975U (en) | 1978-04-05 |
Family
ID=28729490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1976119974U Pending JPS5338975U (en) | 1976-09-08 | 1976-09-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5338975U (en) |
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1976
- 1976-09-08 JP JP1976119974U patent/JPS5338975U/ja active Pending