JPS5332533Y2 - - Google Patents

Info

Publication number
JPS5332533Y2
JPS5332533Y2 JP1972084846U JP8484672U JPS5332533Y2 JP S5332533 Y2 JPS5332533 Y2 JP S5332533Y2 JP 1972084846 U JP1972084846 U JP 1972084846U JP 8484672 U JP8484672 U JP 8484672U JP S5332533 Y2 JPS5332533 Y2 JP S5332533Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1972084846U
Other languages
Japanese (ja)
Other versions
JPS4944157U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972084846U priority Critical patent/JPS5332533Y2/ja
Publication of JPS4944157U publication Critical patent/JPS4944157U/ja
Application granted granted Critical
Publication of JPS5332533Y2 publication Critical patent/JPS5332533Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP1972084846U 1972-07-20 1972-07-20 Expired JPS5332533Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972084846U JPS5332533Y2 (enExample) 1972-07-20 1972-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972084846U JPS5332533Y2 (enExample) 1972-07-20 1972-07-20

Publications (2)

Publication Number Publication Date
JPS4944157U JPS4944157U (enExample) 1974-04-18
JPS5332533Y2 true JPS5332533Y2 (enExample) 1978-08-11

Family

ID=27994270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972084846U Expired JPS5332533Y2 (enExample) 1972-07-20 1972-07-20

Country Status (1)

Country Link
JP (1) JPS5332533Y2 (enExample)

Also Published As

Publication number Publication date
JPS4944157U (enExample) 1974-04-18

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