JPS5332495A - Method of and apparatus for lapping thin plate material - Google Patents

Method of and apparatus for lapping thin plate material

Info

Publication number
JPS5332495A
JPS5332495A JP10654076A JP10654076A JPS5332495A JP S5332495 A JPS5332495 A JP S5332495A JP 10654076 A JP10654076 A JP 10654076A JP 10654076 A JP10654076 A JP 10654076A JP S5332495 A JPS5332495 A JP S5332495A
Authority
JP
Japan
Prior art keywords
thin plate
plate material
lapping
lapping thin
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10654076A
Other languages
Japanese (ja)
Other versions
JPS608184B2 (en
Inventor
Isamu Inoue
Yoshihiro Minamide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP51106540A priority Critical patent/JPS608184B2/en
Publication of JPS5332495A publication Critical patent/JPS5332495A/en
Publication of JPS608184B2 publication Critical patent/JPS608184B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To provide a method of and apparatus for lapping thin plate material, in which lapping for thin plate materials is carried out while they are clamped by means of a first and second holding members substantially with a uniform force along the configuration of the thin plates, whereby the surface of thin plates can be lapped with a higher flatness or straightness.
JP51106540A 1976-09-06 1976-09-06 Method and device for lapping thin plates Expired JPS608184B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51106540A JPS608184B2 (en) 1976-09-06 1976-09-06 Method and device for lapping thin plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51106540A JPS608184B2 (en) 1976-09-06 1976-09-06 Method and device for lapping thin plates

Publications (2)

Publication Number Publication Date
JPS5332495A true JPS5332495A (en) 1978-03-27
JPS608184B2 JPS608184B2 (en) 1985-03-01

Family

ID=14436200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51106540A Expired JPS608184B2 (en) 1976-09-06 1976-09-06 Method and device for lapping thin plates

Country Status (1)

Country Link
JP (1) JPS608184B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56102456A (en) * 1979-12-14 1981-08-15 Hitachi Ltd Method for grinding core assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56102456A (en) * 1979-12-14 1981-08-15 Hitachi Ltd Method for grinding core assembly
JPS5733145B2 (en) * 1979-12-14 1982-07-15

Also Published As

Publication number Publication date
JPS608184B2 (en) 1985-03-01

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